PCB

Rigid & Flex

Low, medium and high complexity

High Density Interconnection (HDI)

High-performance base materials

Complex designs for Signal Integrity, High Speed and RF

Design for Thermal Performance

Finishing: HAL, Ag, Tin, Gold, Organic, others

Capabilities: gold finger, carbon ink, via-in-pad, backdrilling, laser drilling, impedance control, heatsink

Others special requirements.